inquiry
Leave A Message
If you are interested in our products and want to know more details,please leave a message here,we will reply you as soon as we can.
banner
172nm Excimer High-energy UV Cleaning Device Semiconductor Battery Surface Modification
Semiconductor Surface Modification Device
dry organic contaminant removal machine

172nm Excimer High-energy UV Cleaning Device Semiconductor Battery Surface Modification

The 172nm Excimer UV Device delivers high-energy photo-cleaning and nano-level surface modification for semiconductors, batteries, and advanced materials. Utilizing cold 172nm UV photons, this compact system breaks organic chemical bonds and oxidizes contaminants without substrate damage. With a high uniformity of ±15% and operating temperatures under 40°C, it provides an eco-friendly, low-consumption alternative to traditional low-pressure mercury lamps.

  • Model :

    EX-C300
  • Operating Temperature :

    -5℃~50℃
  • Intensity (Distance from the irradiation surface 8mm) :

    >45 mW/cm2
  • Nitrogen Input :

    30Lpm
  • Total Power :

    <400W
  • Input Voltage (V) :

    AC220V
  • 172nm Excimer UV System - EX-C300

    The EX-C300 is a benchtop 172nm Excimer UV system for high-energy photo-cleaning and nano-level surface modification. Designed for R&D and process qualification in semiconductor packaging, wafer fabrication, photomask/FMM maintenance, and advanced materials development, it delivers cold-photon organic contaminant removal without substrate damage, chemical consumption, or thermal impact.

    172nm VUV photons deliver dual-action cleaning: they directly cleave organic chemical bonds (C=C, C-H, O-H) while generating reactive oxygen species (singlet oxygen, ozone). Contaminants oxidize into volatile byproducts and lift off cleanly, leaving an ultra-pure, high-hydrophilicity surface ready for bonding, coating, or deposition — all dry, chemical-free, and at room temperature.

    Our Advantages

    • 01. Customized solutions based on your application demands
    • 02. 30-45 days delivery from design to production
    • 03. Zero development cost | Customizable for single unit

    OPERATION VIDEO

    Application Fields

    Semiconductor Packaging R&D

    Semiconductor Packaging — Pre-Bonding Activation R&D

    R&D teams use the EX-C300 to dial in optimal 172nm VUV parameters — dose, working distance, and cycle time — for activating die-attach, flip-chip, and hybrid bonding surfaces. The benchtop format delivers repeatable surface energy data, forming a validated bonding recipe before production handoff.

     Wafer & Substrate — Pre-Deposition Organic Cleaning

    Researchers treat bare and patterned test wafers with 172nm VUV photons to establish cleanliness baselines prior to ALD, CVD, or PVD. Sub-40°C operation eliminates any thermal budget risk, while post-treatment XPS and contact angle data define the minimum effective dose for process qualification.

    Wafer & Substrate Cleaning
    FMM & Photomask Cleaning

    FMM & Photomask — Damage-Free Organic Cleaning

    The EX-C300 removes organic fouling on fine metal masks and photomasks via purely photochemical oxidation — no contact, no chemicals, no residues. Iterative trials confirm that nanometer-scale mask features remain intact, defining safe cumulative dose and cycle limits for production adoption.

    Advanced Materials — Surface Modification & Wettability Control

    Film and battery R&D labs treat polymer films (PET, PI, COP) and electrode foils under controlled 172nm exposure, then measure contact angle reduction and adhesion gains. The cold-photon process avoids thermal damage to sensitive materials, and the resulting data directly feeds into inline production recipes — bench before fab.

    Advanced Materials Surface Modification

    Key Features

    01 High-Speed Cleaning

    Delivers 10 times the cleaning speed of traditional low-pressure mercury lamps, vastly accelerating inline or batch processing cycles.

    02 Individual Switching

    Allows individual switching of each lamp module depending on processing widths, maximizing energy balance and extending total lamp service life.

    03 Low-Temperature Operation

    Prevents thermal damage on heat-sensitive materials, maintaining a stable substrate surface temperature strictly not exceeding 40℃.

    04 Low Energy Consumption

    Highly eco-friendly architecture that consumes 65% less energy than standard mercury lamp configurations without losing light intensity.

    05 Space-Saving

    Features a highly compact power supply unit, effortlessly supporting the entire treatment system within space-restricted automated production lines.

    06 Easy Maintenance

    Engineered for effortless routine cleaning and maintenance, enabling operators to perform quick lamp exchange to prevent operational downtime.

    07 High Uniformity

    Guarantees an irradiance uniformity of ±15% across the designated irradiation area, significantly increasing batch processing stability.

    Certifications & Compliance

    ISO Certificate
    ISO

    ISO 9001/14001

    Certified quality and environmental management systems ensuring uniform production calibration.

    CE Certified Declaration
    CE

    CE Certified

    Fully compliant with European occupational health, system safety, and protection standards.

    ROHS Compliance Certificate
    RoHS

    ROHS Compliant

    Green hardware architecture free from lead, mercury, and restricted hazardous heavy elements.

    UL Safety Certificate
    UL

    UL Certified

    Meets stringent North American electrical insulation, grounding, and operational safety criteria.

    FAQ

    Q Why choose 172nm single-wavelength excimer light over traditional low-pressure mercury lamps?

    Traditional mercury lamps emit broad wavelengths at 185nm and 254nm, which rely heavily on secondary ozone reactions. Our specialized 172nm excimer system projects a photon energy of 7.2 eV, directly matching and breaking the covalent bond energy of common organic pollutants (C=C, C-H). This provides up to 10 times faster dry clean rates and eliminates high thermal radiation risks.

    Q How does the individual switching feature prevent premature lamp degradation?

    Unlike sequential series connections where one lamp failure compromises the entire array, our system routes isolated electrical ballasts to each individual tube. Users can switch modules independently based on substrate surface width requirements, extending structural run-times and simplifying targeted field replacement without downtime.

    Q What are the core environmental requirements for operating the EX-C300 system?

    The industrial EX-C300 relies on an AC220V power supply, standard ambient operations (-5°C to 50°C), and a regular 25°C recirculating water chiller loop. To maximize VUV processing performance and eliminate internal window oxidation, a stable Nitrogen (N₂) gas influx of 30 Lpm is recommended during ongoing irradiation cycles.
leave a message
If you are interested in our products and want to know more details,please leave a message here,we will reply you as soon as we can.

leave a message

leave a message
If you are interested in our products and want to know more details,please leave a message here,we will reply you as soon as we can.
Contact Us:jwtan@gmyok.com